GE

IS200VVIBH1C Printed Circuit Boards

The surface of the IS200VVIBH1C includes two backplane connectors placed on the rear edge of the board (P1 and P2.) The board has four other connectors designed with conductive traces and dots. There are resistors, diodes, capacitors, and inductor coil/beads located on the board surface. Some of these components also appear on the back surface of the board. Integrated circuits located on the IS200VVIBH1C include FPGAs, RAM and SRAM chips.

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The IS200VVIBH1C has a single-slot faceplate attached to a component dense circuit board. The faceplate has only three components, which are all located at the very top of the covering; these are LED indicators labeled run/fail/status.

The surface of the IS200VVIBH1C includes two backplane connectors placed on the rear edge of the board (P1 and P2.) The board has four other connectors designed with conductive traces and dots. There are resistors, diodes, capacitors, and inductor coil/beads located on the board surface. Some of these components also appear on the back surface of the board. Integrated circuits located on the IS200VVIBH1C include FPGAs, RAM and SRAM chips. Installation procedures can be found in the abovementioned GE publication.

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